Overview

AMD offers solution platforms and meets aerospace and defense industry standards and form-factor solutions in collaboration with our ecosystem partners and through COTS offerings. Available platforms include FACE, HOST, SOSA, and more, 3U and 6U VPX solutions as well as customized and small form factor system-in-package (SiP) solutions.

Platforms

COTS 3U & 6U VPX

Explore AMD UltraScale and Versal architecture-based COTS platforms that satisfy customer requirements for rapid prototyping and system development with common aerospace and defense form-factors and comply with the latest industry standards. 

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AMD Versal AI Core Enabled RF System-in-Package

Ultra-Wideband Direct RF Front-End Processor

The Mercury RFSiP integrates the Versal AI Core adaptive SoC with discrete data converters in a single package, combining direct RF signal processing capacity with massive DSP and AI compute in a small form factor. The SWaP  -optimized platform delivers outstanding performance-per-watt for signal processing in communications, EW, and radar applications. Features:

  • Versal AI Core VC1902, with up to 3.8/1+ TMACs Cint16/Cfp32      
  • 4x Ultra-wideband Tx/Rx channels,10bit, 64 Gsps per channel
  • 36 GHz of analog bandwidth, with 4GHz IBW per channel
  • 300+ Gbps of bandwidth for data offload, via PCIe Gen4 or Ethernet
  • Vitis enabled platform infrastructure with BSP
  • Integrated SWAP Optimized 47.5mm x 47.5mm SiP
Octavo (OSDZU3) System Package

Octavo (OSDZU3) System-in-Package

Compact Easy-to-Use ZU3-Based System Controller

The OSZU3 integrates the AMD Zynq UltraScale+ MPSoC with supporting circuitry into a BGA Package providing a 60% size reduction as compared to a discrete chip-down custom solution.    Developing with the OSDZU3 removes board-level complexity and is designed to reduce design effort by up to 9 months without sacrificing flexibility and performance.   

  • Integrates ZU3 MPSoC, power management, and necessary memories
  • Access to all unused ZU3 I/O in the SiP BGA pinout
  • Single 5V Vin generates all required power rails
  • 1mm pitch BGA allows for low-cost PCB design rules
  • Over 150 components integrated into 1 SiP
  • Helps simplify supply chain 

PCIe Accelerators and AI Cards

AMD Alveo™ cards offer a compelling solution for compute-intensive enterprise and environmentally controlled Government and Defense applications.  Whether it is raw HPC or ML, Alveo enables you to address the solution while minimizing NRE of a custom chip-down solution.  The Alveo V80 brings high-density programmable logic with HBM in a PCIe form factor to enable a broad range of performance computing with the standard form factor which is ideal for enterprise applications.  VCK5000 is enabled with the first-generation AIE which is balanced for DSP and ML compute, and offered in the standard PCIe form factor.

AMD Alveo V80

Alveo V80

Highest logic density, HBM bandwidth, DSP compute, and network throughput in the Alveo portfolio.

AMD Versal VCK 5000

VCK5000 Versal Development Card

Up to 145 INT8 TOPs, 2x100G connectivity, broad application with customizable FPGA logic.

Get in Touch

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Footnotes
  1. Based on the projected combined total DMIPs of the Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 processing systems when configured with 8 Arm Cortex-A78AE applications cores @ 2.2 GHz & 10 Arm Cortex-R52 Real-time cores @ 1.05 GHz, compared to the published combined total DMIPs of the processing systems in the first generation Versal AI Edge Series and Versal Prime Series. Versal AI Edge Series Gen 2 and Prime Series Gen 2 operating conditions: highest available speed grade, 0.88V PS operating voltage, split-mode operation, maximum supported operating frequency. First generation Versal AI Edge Series and Prime Series operation conditions: highest available speed grade, 0.88V PS operating voltage, maximum supported operating frequency. Actual DMIPs performance will vary when final products are released in market.